社群媒體龍頭公司_Silicon Package Development Engineer

Location 信義區 / Xinyi District
台北市 / Taipei City

Job type 派遣 / Contractor

Remote Job available

Salary to

Category Research and Development > Hardware Engineer

  • 接觸AV/VR最先進產品
  • 適合具良好英文溝通能力者的優質美商環境
  • 享受彈性上班時間

Job TitleSilicon Package Development Engineer

Location】Locate in Hsinchu/Taipei

Job Responsibilities

Establish relationship with foundry, OSAT, material supplier & support package development activities for multiple research & product programs as process integration engineer

Support TV design, process feasibility, simulation, design rule/DFM checks with emphasis on thermo-mechanical reliability with vendor

Review & maintain all aspects of design integration (DI) before TO, sign-off & keep all DI documentation upto date

Work with XFN teams, foundries/OSAT, substrate suppliers to understand trade-offs & keep track of technology gaps, reliability risk, yield issues & provide regular updates

Drive DOEs for initial build and product qualification; drive triage effort with partners for any unexpected inline process, equipment & quality issues

Coordinate FA, monitor area/customer critical charts & drive all aspects of FA & compilation of POR, TOR, FMEA & related KPIs at the vendor

 

 

Education/Experience

BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field

10+ years of experience in package development and process integration

 

Additional Required Qualifications

Knowledge of adv. packaging manufacturing processes e.g. WLCSP, SiP, FO, PoP, TSV, 3D

Experience with successful package product qualification with complex package design

Understanding of device reliability and experience with physical failure analysis

Experience with DOE, data analysis & pkg design software is a plus

Experience with display and optic related package is a plus

Experience with TSV process, 2.5D/3D package and Hybrid bonding is a plus

Excellent problem solving & communication skills

Ability to work independently and take on projects with minimum supervision

 

 


Responsibilities


Experience


Education

 
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Contact Details jeffery.su@adecco.com


Date Posted 28/10/2024 1:40:00 PM